Please use this identifier to cite or link to this item: https://ir.swu.ac.th/jspui/handle/123456789/13973
Title: The effects of depositing Sn-Ag-Cu-S systems at different temperatures on silver substrates
Authors: Srisukho P.
Wongpreedee K.
Keywords: Ag substrate
Cu substrate
Effects of temperature
Interface layer
Lead-Free
Nielli inlay
Nielloware
Silver substrate
Alloys
Characterization
Copper compounds
Environmental regulations
Interfaces (materials)
Porosity
Research
Silver
Soldering alloys
Tin
Silver alloys
Issue Date: 2013
Abstract: Niello bars contain Lead which prohibits by laws and danger to environment. This research was to study the effects of temperatures which a black amalgam of lead-free niello bar alloys was filled in carved grooves of 95wt%Ag-5wt%Cu and 99.99wt%Ag substrates at 400°C, 500°C, 600°C and 700°C. Three compositions of lead-free niello bar alloys were selected in this research. The characterizations of microstructure, interface layers, and porosities of lead-free niello bar alloys after applying were reported. The results showed that all three compositions contain six compounds of CuAgS, Ag, Cu2S, Sn2S3, SnS and Cu4SnS4. After applying lead-free niello bar alloys on the substrates, it showed that composition #2 on the 95wt%Ag-5wt%Cu substrates was matched to the best condition of temperature at 600°C giving lowest porosities. © (2013) Trans Tech Publications, Switzerland.
URI: https://ir.swu.ac.th/jspui/handle/123456789/13973
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84886279083&doi=10.4028%2fwww.scientific.net%2fAMR.787.167&partnerID=40&md5=7fe83439da78e8b9693e67c0bc91acd4
ISSN: 10226680
Appears in Collections:Scopus 1983-2021

Files in This Item:
There are no files associated with this item.


Items in SWU repository are protected by copyright, with all rights reserved, unless otherwise indicated.