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Title: | The effects of depositing Sn-Ag-Cu-S systems at different temperatures on silver substrates |
Authors: | Srisukho P. Wongpreedee K. |
Keywords: | Ag substrate Cu substrate Effects of temperature Interface layer Lead-Free Nielli inlay Nielloware Silver substrate Alloys Characterization Copper compounds Environmental regulations Interfaces (materials) Porosity Research Silver Soldering alloys Tin Silver alloys |
Issue Date: | 2013 |
Abstract: | Niello bars contain Lead which prohibits by laws and danger to environment. This research was to study the effects of temperatures which a black amalgam of lead-free niello bar alloys was filled in carved grooves of 95wt%Ag-5wt%Cu and 99.99wt%Ag substrates at 400°C, 500°C, 600°C and 700°C. Three compositions of lead-free niello bar alloys were selected in this research. The characterizations of microstructure, interface layers, and porosities of lead-free niello bar alloys after applying were reported. The results showed that all three compositions contain six compounds of CuAgS, Ag, Cu2S, Sn2S3, SnS and Cu4SnS4. After applying lead-free niello bar alloys on the substrates, it showed that composition #2 on the 95wt%Ag-5wt%Cu substrates was matched to the best condition of temperature at 600°C giving lowest porosities. © (2013) Trans Tech Publications, Switzerland. |
URI: | https://ir.swu.ac.th/jspui/handle/123456789/13973 https://www.scopus.com/inward/record.uri?eid=2-s2.0-84886279083&doi=10.4028%2fwww.scientific.net%2fAMR.787.167&partnerID=40&md5=7fe83439da78e8b9693e67c0bc91acd4 |
ISSN: | 10226680 |
Appears in Collections: | Scopus 1983-2021 |
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