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DC Field | Value | Language |
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dc.contributor.author | Srisukho P. | |
dc.contributor.author | Wongpreedee K. | |
dc.date.accessioned | 2021-04-05T03:32:46Z | - |
dc.date.available | 2021-04-05T03:32:46Z | - |
dc.date.issued | 2013 | |
dc.identifier.issn | 10226680 | |
dc.identifier.other | 2-s2.0-84886279083 | |
dc.identifier.uri | https://ir.swu.ac.th/jspui/handle/123456789/13973 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84886279083&doi=10.4028%2fwww.scientific.net%2fAMR.787.167&partnerID=40&md5=7fe83439da78e8b9693e67c0bc91acd4 | |
dc.description.abstract | Niello bars contain Lead which prohibits by laws and danger to environment. This research was to study the effects of temperatures which a black amalgam of lead-free niello bar alloys was filled in carved grooves of 95wt%Ag-5wt%Cu and 99.99wt%Ag substrates at 400°C, 500°C, 600°C and 700°C. Three compositions of lead-free niello bar alloys were selected in this research. The characterizations of microstructure, interface layers, and porosities of lead-free niello bar alloys after applying were reported. The results showed that all three compositions contain six compounds of CuAgS, Ag, Cu2S, Sn2S3, SnS and Cu4SnS4. After applying lead-free niello bar alloys on the substrates, it showed that composition #2 on the 95wt%Ag-5wt%Cu substrates was matched to the best condition of temperature at 600°C giving lowest porosities. © (2013) Trans Tech Publications, Switzerland. | |
dc.subject | Ag substrate | |
dc.subject | Cu substrate | |
dc.subject | Effects of temperature | |
dc.subject | Interface layer | |
dc.subject | Lead-Free | |
dc.subject | Nielli inlay | |
dc.subject | Nielloware | |
dc.subject | Silver substrate | |
dc.subject | Alloys | |
dc.subject | Characterization | |
dc.subject | Copper compounds | |
dc.subject | Environmental regulations | |
dc.subject | Interfaces (materials) | |
dc.subject | Porosity | |
dc.subject | Research | |
dc.subject | Silver | |
dc.subject | Soldering alloys | |
dc.subject | Tin | |
dc.subject | Silver alloys | |
dc.title | The effects of depositing Sn-Ag-Cu-S systems at different temperatures on silver substrates | |
dc.type | Conference Paper | |
dc.rights.holder | Scopus | |
dc.identifier.bibliograpycitation | Advanced Materials Research. Vol 787, No. (2013), p.167-171 | |
dc.identifier.doi | 10.4028/www.scientific.net/AMR.787.167 | |
Appears in Collections: | Scopus 1983-2021 |
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