Publication:
The effects of depositing Sn-Ag-Cu-S systems at different temperatures on silver substrates

Simple item page
dc.contributor.authorSrisukho P.
dc.contributor.authorWongpreedee K.
dc.date.accessioned2021-04-05T03:32:46Z
dc.date.available2021-04-05T03:32:46Z
dc.date.issued2013
dc.date.issuedBE2556
dc.description.abstractNiello bars contain Lead which prohibits by laws and danger to environment. This research was to study the effects of temperatures which a black amalgam of lead-free niello bar alloys was filled in carved grooves of 95wt%Ag-5wt%Cu and 99.99wt%Ag substrates at 400°C, 500°C, 600°C and 700°C. Three compositions of lead-free niello bar alloys were selected in this research. The characterizations of microstructure, interface layers, and porosities of lead-free niello bar alloys after applying were reported. The results showed that all three compositions contain six compounds of CuAgS, Ag, Cu2S, Sn2S3, SnS and Cu4SnS4. After applying lead-free niello bar alloys on the substrates, it showed that composition #2 on the 95wt%Ag-5wt%Cu substrates was matched to the best condition of temperature at 600°C giving lowest porosities. © (2013) Trans Tech Publications, Switzerland.
dc.format.mimetypeapplication/pdf
dc.identifier.citationAdvanced Materials Research. Vol 787, No. (2013), p.167-171
dc.identifier.doi10.4028/www.scientific.net/AMR.787.167
dc.identifier.issn10226680
dc.identifier.other2-s2.0-84886279083
dc.identifier.urihttps://hdl.handle.net/20.500.14740/6529
dc.rights.holderScopus
dc.subject.otherAg substrate
dc.subject.otherCu substrate
dc.subject.otherEffects of temperature
dc.subject.otherInterface layer
dc.subject.otherLead-Free
dc.subject.otherNielli inlay
dc.subject.otherNielloware
dc.subject.otherSilver substrate
dc.subject.otherAlloys
dc.subject.otherCharacterization
dc.subject.otherCopper compounds
dc.subject.otherEnvironmental regulations
dc.subject.otherInterfaces (materials)
dc.subject.otherPorosity
dc.subject.otherResearch
dc.subject.otherSilver
dc.subject.otherSoldering alloys
dc.subject.otherTin
dc.subject.otherSilver alloys
dc.titleThe effects of depositing Sn-Ag-Cu-S systems at different temperatures on silver substrates
dc.typeConference Paper
dspace.entity.typePublication
swu.datasource.scopushttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84886279083&doi=10.4028%2fwww.scientific.net%2fAMR.787.167&partnerID=40&md5=7fe83439da78e8b9693e67c0bc91acd4

Files

Collections

Scopus: Year 1983-2021