Publication: The effects of depositing Sn-Ag-Cu-S systems at different temperatures on silver substrates
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Issued Date
2013
Resource Type
File Type
application/pdf
ISSN
10226680
Other identifier(s)
2-s2.0-84886279083
Rights Holder(s)
Scopus
Bibliographic Citation
Advanced Materials Research. Vol 787, No. (2013), p.167-171
Suggested Citation
Srisukho P., Wongpreedee K. The effects of depositing Sn-Ag-Cu-S systems at different temperatures on silver substrates. Advanced Materials Research. Vol 787, No. (2013), p.167-171. doi:10.4028/www.scientific.net/AMR.787.167 Retrieved from: https://hdl.handle.net/20.500.14740/6529
Author(s)
Abstract
Niello bars contain Lead which prohibits by laws and danger to environment. This research was to study the effects of temperatures which a black amalgam of lead-free niello bar alloys was filled in carved grooves of 95wt%Ag-5wt%Cu and 99.99wt%Ag substrates at 400°C, 500°C, 600°C and 700°C. Three compositions of lead-free niello bar alloys were selected in this research. The characterizations of microstructure, interface layers, and porosities of lead-free niello bar alloys after applying were reported. The results showed that all three compositions contain six compounds of CuAgS, Ag, Cu2S, Sn2S3, SnS and Cu4SnS4. After applying lead-free niello bar alloys on the substrates, it showed that composition #2 on the 95wt%Ag-5wt%Cu substrates was matched to the best condition of temperature at 600°C giving lowest porosities. © (2013) Trans Tech Publications, Switzerland.