Publication:
Investigation of Contact Angles of SnAgCu Solder Paste Mixed with Graphene Oxide Using Digital Holography Technique

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dc.contributor.authorJongjinakool K.
dc.contributor.authorPrakobsang T.
dc.contributor.authorPlaipichit S.
dc.contributor.authorKanlayasiri K.
dc.contributor.authorKitiwan M.
dc.contributor.authorBuranasiri P.
dc.date.accessioned2022-03-10T13:16:57Z
dc.date.available2022-03-10T13:16:57Z
dc.date.issued2021
dc.date.issuedBE2564
dc.description.abstractSince lead is a pollutant to the environment, therefore lead-free solder paste compounds have been interested in many research teams. The objective of this research is the investigation properties of solder paste with graphene oxide and reduced graphene oxide. In our experimental method the solder pastes of SnAgCu mixed with graphene oxide with bad electrical conductivity at different concentration by weight of 0.00%, 0.05%, 0.1% and 0.2% respectively. Subsequently, the shape changes of the compounds have been investigated by using digital in-line holography using laser diode wavelength 635 nm as the light source. The solder paste compounds were melted at 250 ± 5 °C and were recorded for every 5 seconds. Then, the contact angles of the melted solder paste compound have been determined using their digital holographic reconstructed images. © 2021 IEEE.
dc.format.mimetypeapplication/pdf
dc.identifier.citation2021 2nd International Symposium on Instrumentation, Control, Artificial Intelligence, and Robotics, ICA-SYMP 2021. Vol , No. (2021)
dc.identifier.doi10.1109/ICA-SYMP50206.2021.9358245
dc.identifier.other2-s2.0-85102509822
dc.identifier.urihttps://hdl.handle.net/20.500.14740/7909
dc.language.isoeng
dc.rights.holderScopus
dc.subject.otherAgricultural robots
dc.subject.otherCopper alloys
dc.subject.otherGraphene
dc.subject.otherHolography
dc.subject.otherLaser recording
dc.subject.otherLead compounds
dc.subject.otherLight sources
dc.subject.otherRobotics
dc.subject.otherSilver alloys
dc.subject.otherSoldering
dc.subject.otherTernary alloys
dc.subject.otherTin alloys
dc.subject.otherDigital holography
dc.subject.otherDigital in-line holographies
dc.subject.otherElectrical conductivity
dc.subject.otherExperimental methods
dc.subject.otherLead-free solder paste
dc.subject.otherReconstructed image
dc.subject.otherResearch teams
dc.subject.otherSnAgCu solder
dc.subject.otherLead-free solders
dc.titleInvestigation of Contact Angles of SnAgCu Solder Paste Mixed with Graphene Oxide Using Digital Holography Technique
dc.typeConference Paper
dspace.entity.typePublication
swu.datasource.scopushttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85102509822&doi=10.1109%2fICA-SYMP50206.2021.9358245&partnerID=40&md5=4da637e17f687db9c961dc762c29d017

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