Publication: Investigation of Contact Angles of SnAgCu Solder Paste Mixed with Graphene Oxide Using Digital Holography Technique
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Issued Date
2021
Resource Type
Language
eng
File Type
application/pdf
Other identifier(s)
2-s2.0-85102509822
Rights Holder(s)
Scopus
Bibliographic Citation
2021 2nd International Symposium on Instrumentation, Control, Artificial Intelligence, and Robotics, ICA-SYMP 2021. Vol , No. (2021)
Suggested Citation
Jongjinakool K., Prakobsang T., Plaipichit S., Kanlayasiri K., Kitiwan M., Buranasiri P. Investigation of Contact Angles of SnAgCu Solder Paste Mixed with Graphene Oxide Using Digital Holography Technique. 2021 2nd International Symposium on Instrumentation, Control, Artificial Intelligence, and Robotics, ICA-SYMP 2021. Vol , No. (2021). doi:10.1109/ICA-SYMP50206.2021.9358245 Retrieved from: https://hdl.handle.net/20.500.14740/7909
Abstract
Since lead is a pollutant to the environment, therefore lead-free solder paste compounds have been interested in many research teams. The objective of this research is the investigation properties of solder paste with graphene oxide and reduced graphene oxide. In our experimental method the solder pastes of SnAgCu mixed with graphene oxide with bad electrical conductivity at different concentration by weight of 0.00%, 0.05%, 0.1% and 0.2% respectively. Subsequently, the shape changes of the compounds have been investigated by using digital in-line holography using laser diode wavelength 635 nm as the light source. The solder paste compounds were melted at 250 ± 5 °C and were recorded for every 5 seconds. Then, the contact angles of the melted solder paste compound have been determined using their digital holographic reconstructed images. © 2021 IEEE.
Subject(s)
Agricultural robots
Copper alloys
Graphene
Holography
Laser recording
Lead compounds
Light sources
Robotics
Silver alloys
Soldering
Ternary alloys
Tin alloys
Digital holography
Digital in-line holographies
Electrical conductivity
Experimental methods
Lead-free solder paste
Reconstructed image
Research teams
SnAgCu solder
Lead-free solders
Copper alloys
Graphene
Holography
Laser recording
Lead compounds
Light sources
Robotics
Silver alloys
Soldering
Ternary alloys
Tin alloys
Digital holography
Digital in-line holographies
Electrical conductivity
Experimental methods
Lead-free solder paste
Reconstructed image
Research teams
SnAgCu solder
Lead-free solders