Please use this identifier to cite or link to this item: https://ir.swu.ac.th/jspui/handle/123456789/17371
ชื่อเรื่อง: Investigation of Contact Angles of SnAgCu Solder Paste Mixed with Graphene Oxide Using Digital Holography Technique
ผู้แต่ง: Jongjinakool K.
Prakobsang T.
Plaipichit S.
Kanlayasiri K.
Kitiwan M.
Buranasiri P.
Keywords: Agricultural robots
Copper alloys
Graphene
Holography
Laser recording
Lead compounds
Light sources
Robotics
Silver alloys
Soldering
Ternary alloys
Tin alloys
Digital holography
Digital in-line holographies
Electrical conductivity
Experimental methods
Lead-free solder paste
Reconstructed image
Research teams
SnAgCu solder
Lead-free solders
วันที่เผยแพร่: 2021
บทคัดย่อ: Since lead is a pollutant to the environment, therefore lead-free solder paste compounds have been interested in many research teams. The objective of this research is the investigation properties of solder paste with graphene oxide and reduced graphene oxide. In our experimental method the solder pastes of SnAgCu mixed with graphene oxide with bad electrical conductivity at different concentration by weight of 0.00%, 0.05%, 0.1% and 0.2% respectively. Subsequently, the shape changes of the compounds have been investigated by using digital in-line holography using laser diode wavelength 635 nm as the light source. The solder paste compounds were melted at 250 ± 5 °C and were recorded for every 5 seconds. Then, the contact angles of the melted solder paste compound have been determined using their digital holographic reconstructed images. © 2021 IEEE.
URI: https://ir.swu.ac.th/jspui/handle/123456789/17371
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85102509822&doi=10.1109%2fICA-SYMP50206.2021.9358245&partnerID=40&md5=4da637e17f687db9c961dc762c29d017
Appears in Collections:Scopus 1983-2021

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