Publication:
Thermal performance enhancement of vapor chamber by coating mini-channel heat sink with porous sintering media

dc.contributor.authorWiriyasart S.
dc.contributor.authorNaphon P.
dc.date.accessioned2021-04-05T03:05:16Z
dc.date.available2021-04-05T03:05:16Z
dc.date.issued2018
dc.date.issuedBE2561
dc.description.abstractThis paper have been investigated on the thermal performance enhancement of air cooling vapor chamber by coating mini-channel heat sink inside with porous sintering wick sheet. The results obtained from experiments are considered and compared with without porous sintering wick sheet. The effects of power input, amount of filled working fluid into the vapor chamber and mass flow rate of air on the cooling performance and thermal resistance characteristics are considered. It can be found that the porous sintering wick sheet has significant effect on the increment of the capillary force which results in higher heat transfer rate. Therefore, the thermal performance of air cooling vapor chamber with porous sintering wick sheet inside mini-channel shows 20% maximum higher than that without porous sintering wick sheet. In addition, the increasing of power in put and cooling air mass flow rate have significantly increased thermal performance of the vapor chamber. The passive cooling device with vapor chambers is favorable technique that can enhanced thermal performance and reduce heat accumulate on the electronic component. © 2018
dc.format.mimetypeapplication/pdf
dc.identifier.citationInternational Journal of Heat and Mass Transfer. Vol 126, (2018), p.116-122
dc.identifier.doi10.1016/j.ijheatmasstransfer.2018.05.020
dc.identifier.issn179310
dc.identifier.other2-s2.0-85046770614
dc.identifier.urihttps://hdl.handle.net/20.500.14740/5802
dc.rights.holderมหาวิทยาลัยศรีนครินทรวิโรฒ
dc.subject.otherAir
dc.subject.otherCoatings
dc.subject.otherElectronic cooling
dc.subject.otherHeat resistance
dc.subject.otherHeat sinks
dc.subject.otherMass transfer
dc.subject.otherCooling performance
dc.subject.otherElectronic component
dc.subject.otherMass flow rate of air
dc.subject.otherPorous sintering wick sheet
dc.subject.otherResistance characteristics
dc.subject.otherThermal Performance
dc.subject.otherThermal performance enhancements
dc.subject.otherVapor chamber
dc.subject.otherSintering
dc.titleThermal performance enhancement of vapor chamber by coating mini-channel heat sink with porous sintering media
dc.typeArticle
dspace.entity.typePublication
swu.datasource.scopushttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85046770614&doi=10.1016%2fj.ijheatmasstransfer.2018.05.020&partnerID=40&md5=b8a174f8321cb09fdee14f0ccd822295

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