Publication: Contact Angle Measurement of Melting SnAgCu Solder Paste Mix with Carbon Allotropes Using In-Line Digital Holography Technique
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Issued Date
2021
Resource Type
Language
eng
File Type
application/pdf
ISSN
10139826
Other identifier(s)
2-s2.0-85122158224
Rights Holder(s)
Scopus
Bibliographic Citation
Key Engineering Materials. Vol 904 KEM, No. (2021), p.369-374
Suggested Citation
Mamart W., Somdock N., Boonsri C., Plaipichit S., Buranasiri P., Kanlayasiri K. Contact Angle Measurement of Melting SnAgCu Solder Paste Mix with Carbon Allotropes Using In-Line Digital Holography Technique. Key Engineering Materials. Vol 904 KEM, No. (2021), p.369-374. doi:10.4028/www.scientific.net/KEM.904.369 Retrieved from: https://hdl.handle.net/20.500.14740/7934
Abstract
In this research we investigated the contact angle of commercial SnAgCu solder paste mixing with some carbon allotropes such as graphite, graphene quantum dots, and fullerene of varying concentrations with melting temperature, wettability, interfacial microstructure. The wettability was assessed in terms of the contact angle. The in-line digital holography was used for determining the contact angle and morphological of samples at each temperature which the samples have been heating from room temperature until the melting temperature. In the experiment, only one beam was used as the object and reference beams which recorded by a CMOS camera. The recorded image was reconstructed by the angular spectrum digital holography numerical programing. Using the reconstructed images of our results, the shape and contact angle of solder pastes can be investigated. © 2021 Trans Tech Publications Ltd, Switzerland.
Subject(s)
Copper alloys
Fullerenes
Graphene
Lead-free solders
Melting point
Nanocrystals
Semiconductor quantum dots
Silver alloys
Soldering
Spectrum analysis
Ternary alloys
Tin alloys
Wetting
Carbon allotropes
Contact angel
Contact-angle measurements
Graphene quantum dot and fullerene
In-line digital holography
Interfacial microstructure
Measurements of
Object beam
SnAgCu solder
Solderpaste
Contact angle
Fullerenes
Graphene
Lead-free solders
Melting point
Nanocrystals
Semiconductor quantum dots
Silver alloys
Soldering
Spectrum analysis
Ternary alloys
Tin alloys
Wetting
Carbon allotropes
Contact angel
Contact-angle measurements
Graphene quantum dot and fullerene
In-line digital holography
Interfacial microstructure
Measurements of
Object beam
SnAgCu solder
Solderpaste
Contact angle