Publication: Thermal cooling enhancement techniques for electronic components
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Issued Date
2015
Resource Type
File Type
application/pdf
ISSN
7351933
Other identifier(s)
2-s2.0-84920903496
Rights Holder(s)
Scopus
Bibliographic Citation
International Communications in Heat and Mass Transfer. Vol 61, (2015), p.140-145
Suggested Citation
Naphon P., Wiriyasart S., Wongwises S. Thermal cooling enhancement techniques for electronic components. International Communications in Heat and Mass Transfer. Vol 61, (2015), p.140-145. doi:10.1016/j.icheatmasstransfer.2014.12.005 Retrieved from: https://hdl.handle.net/20.500.14740/6176
Author(s)
Abstract
Due to highly effective thermal spreaders, the vapor chambers have been widely applied on the electronic cooling. An effective thermal spreader can achieve more uniform heat flux distribution and thus enhance heat dissipation of heat sinks. This work investigates the thermal performance characteristics plate-fin vapor chamber. Parametric studies including different operating operation of CPU, coolant types, working fluids, filled ratios, flow direction of coolants, heat sink configurations, and the effect of the relevant parameters on the cooling performance in terms of the thermal resistance was considered and discussed. The results showed that the relevant parameters have a significant influence on the thermal resistance of the vapor chamber. © 2014 Elsevier Ltd.