Publication:
Effect of resin compositions on microwave processing and thermophysical properties of benzoxazine-epoxy-phenolic ternary systems filled with silicon carbide (SiC) whisker

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Issued Date

2009

Resource Type

Conference Paper

File Type

application/pdf

ISSN

323888

DOI

10.1002/pen.21358

Other identifier(s)

2-s2.0-67649554204

Rights Holder(s)

Scopus

Bibliographic Citation

Polymer Engineering and Science. Vol 49, No.5 (2009), p.1022-1029

Suggested Citation

Jubsilp C., Takeichi T., Hiziroglu S., Rimdusit S. Effect of resin compositions on microwave processing and thermophysical properties of benzoxazine-epoxy-phenolic ternary systems filled with silicon carbide (SiC) whisker. Polymer Engineering and Science. Vol 49, No.5 (2009), p.1022-1029. doi:10.1002/pen.21358 Retrieved from: https://hdl.handle.net/20.500.14740/6783

Title

Effect of resin compositions on microwave processing and thermophysical properties of benzoxazine-epoxy-phenolic ternary systems filled with silicon carbide (SiC) whisker

Author(s)

Jubsilp C.
 Takeichi T.
 Hiziroglu S.
 Rimdusit S.

Abstract

Microwave processing of silicon carbide (SiC) whisker filled ternary systems based on benzoxazine, epoxy, and phenolic resins has been investigated using an industrial microwave apparatus at a fixed frequency of 2.45 GHz. The low viscosity molding compound and void-free cured specimens can easily be obtained from the resin mixtures. Increasing of epoxy mass fraction in the ternary systems provided a better microwave coupling, therefore, a faster curing time and higher conversion under microwave irradiation. However, the greater amount of epoxy resin in the mixture was observed to retard the traditional thermal cure process as seen in the shifting of the exothermic curing peaks to higher temperature. The higher dielectric constant of epoxy resin comparing with the benzoxazine resin can be attributed to the observed phenomenon. Additionally, benzoxazine fraction was found to render a reduction in linear thermal expansion coefficient of the ternary systems. The development of ternary systems yields the polymer systems with high flexibility in resin- curing agent mixing ratios with relatively high T g in the broader range of mixing ratios i.e., BEP451-BEP811. Synergism in glass transition temperature of the ternary systems is also observed with the maximum T g up to 160°C in BEP721. © 2009 Society of Plastics Engineers.

Subject(s)

Benzoxazine
 Benzoxazine resin
 Cure process
 Curing agents
 Curing time
 Dielectric constants
 Fixed frequency
 Glass transition temperature
 High flexibility
 High-T
 Higher temperatures
 Linear thermal expansion coefficients
 Low viscosity
 Mass fraction
 Microwave apparatus
 Microwave coupling
 Microwave processing
 Mixing ratios
 Molding compound
 Polymer systems
 Resin composition
 Resin mixtures
 Thermo-physical property
 Void-free
 Curing
 Glass transition
 Microwave irradiation
 Phenolic resins
 Phenols
 Resins
 Silicon carbide
 Ternary systems
 Thermal expansion
 Epoxy resins

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URI

https://hdl.handle.net/20.500.14740/6783

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Scopus: Year 1983-2021

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