Publication:
Ionized magnetron sputter deposition of hard nanocomposite TiN/amorphous-silicon nitride films

dc.contributor.authorPhinichka N.
dc.contributor.authorChandra R.
dc.contributor.authorBarber Z.H.
dc.date.accessioned2021-04-05T04:32:46Z
dc.date.available2021-04-05T04:32:46Z
dc.date.issued2004
dc.date.issuedBE2547
dc.description.abstractThe deposition of Ti-Si-N films using separate Ti and Si targets in an Ar/N2 gas mixture was analyzed using ionized magnetron sputter deposition (IMSD). The effects of different operational parameters on film structure and mechanical properties were investigated using deposition under various conditions. X-ray diffraction was used to characterize crystallography, grain size and film texture such that addition of Si to TiN transformed (111)-oriented structure. The results show that hardness of films increased to as much as twice that of pure TiN films using nanoidentation.
dc.format.mimetypeapplication/pdf
dc.identifier.citationJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films. Vol 22, No.3 (2004), p.477-481
dc.identifier.doi10.1116/1.1690778
dc.identifier.issn7342101
dc.identifier.other2-s2.0-3142518030
dc.identifier.urihttps://hdl.handle.net/20.500.14740/6414
dc.rights.holderมหาวิทยาลัยศรีนครินทรวิโรฒ
dc.subject.otherCrystallography
dc.subject.otherDislocations (crystals)
dc.subject.otherElastic moduli
dc.subject.otherFilm growth
dc.subject.otherGrain size and shape
dc.subject.otherHardness
dc.subject.otherMagnetron sputtering
dc.subject.otherNanostructured materials
dc.subject.otherPhysical vapor deposition
dc.subject.otherPlasma enhanced chemical vapor deposition
dc.subject.otherPlasmas
dc.subject.otherSputter deposition
dc.subject.otherStoichiometry
dc.subject.otherTitanium alloys
dc.subject.otherChemical stability
dc.subject.otherIon fluxes
dc.subject.otherNanoindentation
dc.subject.otherOperational parameters
dc.subject.otherThin films
dc.titleIonized magnetron sputter deposition of hard nanocomposite TiN/amorphous-silicon nitride films
dc.typeArticle
dspace.entity.typePublication
swu.datasource.scopushttps://www.scopus.com/inward/record.uri?eid=2-s2.0-3142518030&doi=10.1116%2f1.1690778&partnerID=40&md5=c180eda6374d50362780fbdf55ef74bd

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