Publication: Analysis of the Thermal Conductivity Mechanism Affecting on the Plasma Parameters in Instability Low Current Vacuum Arc
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Issued Date
2024-01-01
Resource Type
ISSN
00332097
eISSN
24499544
Scopus ID
2-s2.0-85202517659
Journal Title
Przeglad Elektrotechniczny
Issue
9
Start Page
194
End Page
197
Rights Holder(s)
SCOPUS
Bibliographic Citation
Przeglad Elektrotechniczny No.9 (2024) , 194-197
Suggested Citation
Pankaew P., Mungkung N., Arunrungrusmi S., Tunlasakun K., Kasayapanand N., Poonthong W., Songruk A., Siricharoenpanich A. Analysis of the Thermal Conductivity Mechanism Affecting on the Plasma Parameters in Instability Low Current Vacuum Arc. Przeglad Elektrotechniczny No.9 (2024) , 194-197. 197. doi:10.15199/48.2024.09.37 Retrieved from: https://hdl.handle.net/20.500.14740/20647
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Abstract
This analysis used the cathode spot model to describe the physical mechanism of the thermal conductivity effect on the instability phenomena. An analysis of stable arc current is performed by changing the thermal conductivity of copper by compound material. The minimum stability arc was found to be inversely proportional to the thermal conductivity. Low thermal conductivity is more critical in a more stable arc than a high thermal conductivity cathode material. The thermal conductivity is reduced to increase stable arc current by reducing reversed electrons from the plasma region. These results were similar to the obtained data, indicating that this analysis by the cathode spot model, which is used to investigate the thermal conductivity effect in low-current vacuum arc, may be valid for volatile materials.