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Thermal cooling system with Ag/Fe3O4nanofluids mixture as coolant for electronic devices cooling

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dc.contributor.authorSiricharoenpanich A.
dc.contributor.authorWiriyasart S.
dc.contributor.authorSrichat A.
dc.contributor.authorNaphon P.
dc.date.accessioned2021-04-05T03:01:20Z
dc.date.available2021-04-05T03:01:20Z
dc.date.issued2020
dc.date.issuedBE2563
dc.description.abstractThe thermal dissipation resistance has encountered a problem in the thermal analysis of the electronic components. Due to the limitation of the coolant heat removal capacity, the nanofluid and flow feature of the coolant flowing through the thermal cooling system have proposed. The mixture of Ag and Fe3O4 nanoparticles and flow direction guide vane of coolant for cooling electronic devices have been investigated. The effects of coolant flow rate, coolant type, and heat sink configuration on the thermal dissipation efficiency are considered. Ag and Fe3O4 nanoparticles suspending in the base fluid test and compared with the de-ionized water. The obtained results found that the proposed water blocks have a significant effect on the flow feature of coolant flowing through the thermal cooling system, which results in 11.94% increase in thermal dissipation efficiency. Besides, the thermal dissipation efficiency from Ag/Fe3O4 nanofluid mixture as the coolant is higher than Ag nanofluids and higher than that de-ionized water as the coolant, respectively. © 2020 The Authors.
dc.format.mimetypeapplication/pdf
dc.identifier.citationCase Studies in Thermal Engineering. Vol 20, (2020)
dc.identifier.doi10.1016/j.csite.2020.100641
dc.identifier.issn2214157X
dc.identifier.other2-s2.0-85089491060
dc.identifier.urihttps://hdl.handle.net/20.500.14740/4453
dc.rights.holderมหาวิทยาลัยศรีนครินทรวิโรฒ
dc.subject.otherCoolants
dc.subject.otherCooling systems
dc.subject.otherEfficiency
dc.subject.otherElectronic equipment
dc.subject.otherHeat sinks
dc.subject.otherIonization
dc.subject.otherIron oxides
dc.subject.otherMagnetite
dc.subject.otherMixtures
dc.subject.otherNanofluidics
dc.subject.otherNanoparticles
dc.subject.otherThermoanalysis
dc.subject.otherThermoelectric equipment
dc.subject.otherCoolant flow rates
dc.subject.otherElectronic component
dc.subject.otherElectronic device
dc.subject.otherFe3O4 nanoparticles
dc.subject.otherFlow direction
dc.subject.otherHeat removal capacity
dc.subject.otherThermal cooling
dc.subject.otherThermal dissipation
dc.subject.otherElectronic cooling
dc.titleThermal cooling system with Ag/Fe3O4nanofluids mixture as coolant for electronic devices cooling
dc.typeArticle
dspace.entity.typePublication
swu.datasource.scopushttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85089491060&doi=10.1016%2fj.csite.2020.100641&partnerID=40&md5=59b90f11a1ed4662d93616050ed98a27

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