Publication: The investigation of thermal effect on dynamical shape changing of solder paste by using double-view digital holography
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Issued Date
2015
Resource Type
File Type
application/pdf
ISSN
0277786X
Other identifier(s)
2-s2.0-84960924975
Rights Holder(s)
มหาวิทยาลัยศรีนครินทรวิโรฒ
Bibliographic Citation
Proceedings of SPIE - The International Society for Optical Engineering. Vol 9659, (2015)
Suggested Citation
Thong-On T., Prakobsang T., Pethsanthad W., Boonsri C., Plaipichit S., Buranasiri P., Yoshimori K. The investigation of thermal effect on dynamical shape changing of solder paste by using double-view digital holography. Proceedings of SPIE - The International Society for Optical Engineering. Vol 9659, (2015). doi:10.1117/12.2196277 Retrieved from: https://hdl.handle.net/20.500.14740/6256
Abstract
In this paper we propose a modern technique to evaluate the shape changes of solder paste by using double-view in-line digital holography. We observed the transformation of three different kinds of solder paste composition: pure solder paste, solder paste mixed with 0.02%, 0.05%, 0.10% graphene (GPN) and 0.02%, 0.05%, 0.10% graphene oxide (GPNO), respectively. The shape of the solder pastes was investigated at different melt temperatures (i.e. 200°C, 250°C, and 300°C) for 30 seconds using a collimated beam propagating through the solder paste, then being double reflected on a mirror and second incident on another sides of the solder paste. The double images bearing beams were recorded with a CCD sensor simultaneously. The single recorded digital hologram from double view technique was reconstructed using digital holography. The results show that the double-view technique provides reliably data. Moreover, it would be developed for observing more than two images by single holography writing in the future. © 2015 SPIE.