Publication: Effect of heat source area on the thermal resistance of the wick columns vapor chambers
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Issued Date
2016
Resource Type
File Type
application/pdf
ISSN
1738494X
Other identifier(s)
2-s2.0-84957938383
Rights Holder(s)
มหาวิทยาลัยศรีนครินทรวิโรฒ
Bibliographic Citation
Journal of Mechanical Science and Technology. Vol 30, No.2 (2016), p.933-942
Suggested Citation
Wiriyasart S., Naphon P. Effect of heat source area on the thermal resistance of the wick columns vapor chambers. Journal of Mechanical Science and Technology. Vol 30, No.2 (2016), p.933-942. doi:10.1007/s12206-016-0147-0 Retrieved from: https://hdl.handle.net/20.500.14740/5690
Author(s)
Abstract
The results of the spreading thermal resistance, heat transfer and flow characteristics of the vapor chamber embedded with plate fin are investigated. The experiments are performed with the vapor chambers with wick plate and wick columns embedded plate fin. Parametric studies including different heat fluxes, heated surface areas, flow rate of coolants on the cooling performance in terms of the spreading thermal resistance and heat transfer characteristics are considered. A three-dimensional heat and mass transfer model for the vapor chamber with wick plate and wick columns are developed. The velocity and pressure distributions of liquid phase and vapor phase inside the vapor chamber obtained from the simulation are shown. By comparing the experimental results with numerical results, reasonable agreement is obtained. It can be found that the heat input and heat source area have significant effect on the decreasing of the boiling and condensation thermal resistances while they are slightly effect on the decreasing of the convective thermal resistance. Due to the wick plate and wick columns, the capillary force has significant effect on the working fluid circulation, evaporation rate and flow directions of the liquid and vapor phases inside the vapor chamber. The results of this study are of technological importance for the efficient design of cooling system of the personal computer or electronic devices to enhance cooling performance of the vapor chamber. © 2016, The Korean Society of Mechanical Engineers and Springer-Verlag Berlin Heidelberg.
Subject(s)
Cooling
Electronic cooling
Fins (heat exchange)
Heat transfer
Mass transfer
Personal computers
Thermoelectric equipment
Boiling and condensations
Cooling performance
Heat and mass transfer models
Heat sources
Heat transfer and flows
Heat transfer characteristics
Plate fins
Spreading thermal resistance
Heat resistance
Electronic cooling
Fins (heat exchange)
Heat transfer
Mass transfer
Personal computers
Thermoelectric equipment
Boiling and condensations
Cooling performance
Heat and mass transfer models
Heat sources
Heat transfer and flows
Heat transfer characteristics
Plate fins
Spreading thermal resistance
Heat resistance