Publication:
A study of thermal conductivity property of socks

dc.contributor.authorWang W.
dc.contributor.authorHui K.-T.
dc.contributor.authorKan C.-W.
dc.contributor.authorVisephan K.
dc.contributor.authorAreechongchareon S.
dc.contributor.authorTiyasri S.
dc.contributor.authorMongkholrattanasit R.
dc.date.accessioned2021-04-05T03:01:49Z
dc.date.available2021-04-05T03:01:49Z
dc.date.issued2020
dc.date.issuedBE2563
dc.description.abstractSocks fabrics seem a minor clothing in apparel categories but are indispensable item for daily activities for users. The function of socks is either for heat insulation of body temperature in cold weather or heat releasing to keep thermal neutral for foot in hot weather. Socks with good quality are conducive to prevent foot disease or smelly odor from foot. The wearing comfort of socks can be affected by the fabric properties of thermal transfer. The present study aims to investigate the relationship between the fabric parameters and thermal conductivity property of knitted socks fabric. The physical test on commercial socks fabric was carried out in standard condition atmosphere. It was found that the thermal conductivity of fabric was positively proportional to yarn count and thickness. © 2020 Trans Tech Publications Ltd, Switzerland.
dc.format.mimetypeapplication/pdf
dc.identifier.citationMaterials Science Forum. Vol 1007 MSF, (2020), p.118-124
dc.identifier.doi10.4028/www.scientific.net/MSF.1007.118
dc.identifier.issn2555476
dc.identifier.other2-s2.0-85090322259
dc.identifier.urihttps://hdl.handle.net/20.500.14740/4793
dc.rights.holderScopus
dc.subject.otherHosiery manufacture
dc.subject.otherThermal insulation
dc.subject.otherBody temperature
dc.subject.otherConductivity properties
dc.subject.otherDaily activity
dc.subject.otherFabric parameters
dc.subject.otherFabric properties
dc.subject.otherPhysical tests
dc.subject.otherStandard conditions
dc.subject.otherThermal transfer
dc.subject.otherThermal conductivity
dc.titleA study of thermal conductivity property of socks
dc.typeConference Paper
dspace.entity.typePublication
swu.datasource.scopushttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85090322259&doi=10.4028%2fwww.scientific.net%2fMSF.1007.118&partnerID=40&md5=2dfa39fc2246973d5c9e7a9556ba5c68

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