Publication:
Thermal insulation produced from pineapple leaf fiber and natural rubber latex

dc.contributor.authorKumfu S.
dc.contributor.authorJintakosol T.
dc.date.accessioned2021-04-05T03:34:15Z
dc.date.available2021-04-05T03:34:15Z
dc.date.issued2012
dc.date.issuedBE2555
dc.description.abstractThe objective of this study was to investigate the thermal property of thermal insulation board produced from admixtures of pineapple leaf fiber and natural rubber latex at different proportion level and the thermal property was evaluated based on the American Society for Testing Materials standard. Thermal insulation boards were fabricated using a hot pressing technique at a temperature of 150 °C under a pressure of 100 kg/cm 2 for 5 min to form a squared thermal insulation with the size of 35 cm and 0.9 cm thickness. The thermal conductivity of the thermal insulation was 0.057 W/m K with density of 338 kg/m 3. The success of this study primarily proclaims a high feasibility of producing thermal insulation from pineapple leaf fiber and natural rubber latex as a substitute for synthetic fiber. © (2012) Trans Tech Publications.
dc.format.mimetypeapplication/pdf
dc.identifier.citationAdvanced Materials Research. Vol 506, No. (2012), p.453-456
dc.identifier.doi10.4028/www.scientific.net/AMR.506.453
dc.identifier.issn10226680
dc.identifier.other2-s2.0-84860818090
dc.identifier.urihttps://hdl.handle.net/20.500.14740/7050
dc.rights.holderScopus
dc.subject.otherAmerican society for testing materials
dc.subject.otherNatural rubber latex
dc.subject.otherPineapple leaf fiber
dc.subject.otherThermal insulation boards
dc.subject.otherBiological materials
dc.subject.otherHot pressing
dc.subject.otherLatexes
dc.subject.otherRubber
dc.subject.otherRubber testing
dc.subject.otherSynthetic fibers
dc.subject.otherThermal insulation
dc.subject.otherThermodynamic properties
dc.subject.otherThermal conductivity
dc.titleThermal insulation produced from pineapple leaf fiber and natural rubber latex
dc.typeConference Paper
dspace.entity.typePublication
swu.datasource.scopushttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84860818090&doi=10.4028%2fwww.scientific.net%2fAMR.506.453&partnerID=40&md5=ebe3a24537c671bd4dc1943fa58dfa8e

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