Please use this identifier to cite or link to this item: https://ir.swu.ac.th/jspui/handle/123456789/13972
Title: Interface layers of Ag-Al fusing metals by casting processes
Authors: Wongpreedee K.
Ruethaitananon P.
Isariyamateekun T.
Keywords: Aluminium metals
Bonding process
Casting temperatures
Interface layer
Mass production
Niche marketings
Two-color
Varied parameters
Aluminum
Bottles
Commerce
Intermetallics
Metals
Production engineering
Research
Silver
Silver alloys
Issue Date: 2013
Abstract: The materials of fusing metals commercially used in the jewelry niche marketing is seen as precious metals. An innovation of fusing metals searched for new materials to differentiate from the markets for mass production. In this research, it studied the bonding processes of silver and aluminium metals by casting processes for mass productions. The studies had been varied parameters on the types of aluminium and process temperature controls. This research had used two types of aluminium which were pure aluminium 99.99% and aluminum 5083 alloys bonding with pure silver 99.99%. The temperatures had been specified for two factors including casting temperature at X1, X2 and flasking temperature at Y1, Y2. From the results, it was found that the casting temperature at 730°C and the flasking temperature at 230 °C of pure silver-aluminum 5083 alloys bonding had the thinnest average thickness of interface at 427.29 μm. The microstructure of pure silver-aluminum 5083 alloy bonding was revealed eutectic-like structures at the interfaces. The EDS analysis showed the results of compounds at interface layers of Ag sides giving Ag2Al intermetallics on pure silver-aluminum 5083 alloy bonding unlike pure silver-pure aluminium bonding giving Ag3Al intermetallics. © (2013) Trans Tech Publications, Switzerland.
URI: https://ir.swu.ac.th/jspui/handle/123456789/13972
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84886266249&doi=10.4028%2fwww.scientific.net%2fAMR.787.341&partnerID=40&md5=9260e09bd3f170f9ec0f8e0fc1d29c0b
ISSN: 10226680
Appears in Collections:Scopus 1983-2021

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