Please use this identifier to cite or link to this item: http://ir.swu.ac.th/jspui/handle/123456789/13723
Title: Thermal cooling enhancement techniques for electronic components
Authors: Naphon P.
Wiriyasart S.
Wongwises S.
Keywords: Coolants
Cooling
Heat flux
Heat resistance
Heat sinks
Spreaders
Cooling performance
Electronic component
Parametric study
Thermal cooling
Thermal Performance
Thermal spreaders
Uniform heat flux
Vapor chamber
Electronic cooling
Issue Date: 2015
Abstract: Due to highly effective thermal spreaders, the vapor chambers have been widely applied on the electronic cooling. An effective thermal spreader can achieve more uniform heat flux distribution and thus enhance heat dissipation of heat sinks. This work investigates the thermal performance characteristics plate-fin vapor chamber. Parametric studies including different operating operation of CPU, coolant types, working fluids, filled ratios, flow direction of coolants, heat sink configurations, and the effect of the relevant parameters on the cooling performance in terms of the thermal resistance was considered and discussed. The results showed that the relevant parameters have a significant influence on the thermal resistance of the vapor chamber. © 2014 Elsevier Ltd.
URI: https://www.scopus.com/inward/record.uri?eid=2-s2.0-84920903496&doi=10.1016%2fj.icheatmasstransfer.2014.12.005&partnerID=40&md5=7a86b17f3a30ec888d43566a18d8dbc6
http://ir.swu.ac.th/jspui/handle/123456789/13723
ISSN: 7351933
Appears in Collections:Scopus 1983-2021

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