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Title: On the thermal cooling of central processing unit of the PCs with vapor chamber
Authors: Naphon P.
Wongwises S.
Wiriyasart S.
Keywords: Computer processing
Cooling performance
Cooling technique
Efficient designs
Electronic device
Electronics cooling
Experimental investigations
No load
Operating condition
Operating loads
Parametric study
Real operating conditions
Thermal cooling
Vapor chamber
Working fluid
Aspect ratio
Cooling systems
Energy utilization
Personal computers
Program processors
Thermoelectric equipment
Water vapor
Electronic cooling
Issue Date: 2012
Abstract: An experimental investigation on the thermal cooling of vapor chamber for cooling computer processing unit of the personal computer is performed. Two different configurations of the vapor chambers with de-ionized water as working fluid are tested under the real operating conditions of PCs. Parametric studies including different aspect ratios, fill ratios, and operating conditions of PC on the CPU temperature are considered. It was found that the vapor chamber cooling technique has significant effect on the thermal cooling of CPU. Average CPU temperatures obtained from the vapor chamber cooling system are 4.1%, 6.89% lower than those from the conventional cooling system for no load and 90% operating loads, respectively. In additional, this cooling system requires 6.89%, 10.53% lower energy consumption for no load and 90% operating loads, respectively. The results of this study are of technological importance for the efficient design of cooling systems of the personal computers or electronic devices to enhance cooling performance. © 2012 Elsevier Ltd.
ISSN: 7351933
Appears in Collections:Scopus 1983-2021

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