Please use this identifier to cite or link to this item: https://ir.swu.ac.th/jspui/handle/123456789/27474
Title: Characterization and electrochemical properties of CuO–Cu2O@rGO nanocomposite synthesized by a seed-mediated growth process
Authors: Wongjom P.
Tuichai W.
Karaphun A.
Phrompet C.
Daengsakul S.
Pimanpang S.
Moontragoon P.
Srepusharawoot P.
Sriwong C.
Ruttanapun C.
Keywords: Agglomeration
Copper oxides
Electric discharges
Electrochemical electrodes
Graphene
High resolution transmission electron microscopy
Nanocomposites
Nanoparticles
X ray diffraction analysis
CuO–cu2O@reduced graphene oxide nanocomposite (CuO–cu2O@reduced graphene oxide NCP)
Graphene oxide nanocomposites
Issue Date: 2022
Abstract: A CuO–Cu2O@rGO nanocomposite (CuO–Cu2O@rGO NCP) has been successfully prepared through a seed-mediated growth process. X-ray diffraction (XRD) analysis results indicated a monoclinic phase of CuO–Cu2O@rGO NCP with space group C2/c. Transmission electron microscopy (TEM) revealed agglomeration of the CuO and Cu2O nanoparticles in the rGO sheet matrix. The interaction of CuO–Cu2O@rGO NPC resulted from the aggregation and overlapping of CuO and Cu2O nanoparticles owing to the influence of a seed-mediated growth process. The electrochemical properties of the CuO–Cu2O@rGO NPC electrode indicate the storage of energy at the surface through a pseudo-capacitive mechanism. The specific capacitance at a current density of 0.5 A g−1 and the average percentage capacity retention after 1000 cycles of a CuO–Cu2O@rGO electrode at a current density of 10 A g−1 were evaluated as 125.54 F g−1 and 89.87 ± 3.30%, respectively. In the CuO–Cu2O@rGO electrode, the incorporated rGO affects the electrical conductivity and the synergistic interactions in charge–discharge processes. Interestingly, these results showed that the material was synthesized through a seed-mediated growth process and reveal the key factors that determine the combination and volume expansion of the reversible redox transition between Cu+ and Cu2+ during charge–discharge processes. © 2021 Elsevier Ltd
URI: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85121718209&doi=10.1016%2fj.jpcs.2021.110540&partnerID=40&md5=53fcc5d1d63cc1f5a59ce8d71b34adc6
https://ir.swu.ac.th/jspui/handle/123456789/27474
ISSN: 223697
Appears in Collections:Scopus 2022

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