Please use this identifier to cite or link to this item: https://ir.swu.ac.th/jspui/handle/123456789/17333
Full metadata record
DC FieldValueLanguage
dc.contributor.authorWicharn S.
dc.contributor.authorPlaipichit S.
dc.contributor.authorBuranasiri P.
dc.date.accessioned2022-03-10T13:16:52Z-
dc.date.available2022-03-10T13:16:52Z-
dc.date.issued2021
dc.identifier.other2-s2.0-85107756826
dc.identifier.urihttps://ir.swu.ac.th/jspui/handle/123456789/17333-
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85107756826&doi=10.1109%2fiEECON51072.2021.9440252&partnerID=40&md5=d22ef282402f89135139966304bacbd7
dc.description.abstractWe proposed a dual-band absorber in the visible regime by using nanowire-hyperbolic medium, which is composed of an array of subwavelength-sized hybrid nanowires immersed in dielectric matrix, as a top layer, silicon dioxide as a middle layer, and gold as a bottom layer. Each nanowire is made by core-shell structure, which has silicon as a core and gold as a shell. We found that the dual-band absorption originated from impedance matching between incident medium impedance and input impedance of the proposed absorber at first-and second-order resonant modes. Furthermore, the absorbance can be controlled by adding or reducing filling factor of hyperbolic medium layer. In addition, the absorption performance of the absorber retains well in wide angles. This dual-band absorber is a good candidate for potential applications such as thermal radiation tailoring and sensitive detection. © 2021 IEEE.
dc.languageen
dc.subjectGold
dc.subjectSilica
dc.subjectAbsorption performance
dc.subjectCore shell structure
dc.subjectDielectric matrixes
dc.subjectFilling factor
dc.subjectHybrid nanowires
dc.subjectInput impedance
dc.subjectSensitive detection
dc.subjectSub-wavelength
dc.subjectNanowires
dc.titleWide-Angle Dual-Band Absorber Based on Nanowire-Hyperbolic Medium
dc.typeConference Paper
dc.rights.holderScopus
dc.identifier.bibliograpycitationProceeding of the 2021 9th International Electrical Engineering Congress, iEECON 2021. Vol , No. (2021), p.511-514
dc.identifier.doi10.1109/iEECON51072.2021.9440252
Appears in Collections:Scopus 1983-2021

Files in This Item:
There are no files associated with this item.


Items in SWU repository are protected by copyright, with all rights reserved, unless otherwise indicated.