Please use this identifier to cite or link to this item: https://ir.swu.ac.th/jspui/handle/123456789/17272
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dc.contributor.authorSiricharoenpanich A.
dc.contributor.authorWiriyasart S.
dc.contributor.authorNaphon P.
dc.date.accessioned2022-03-10T13:16:42Z-
dc.date.available2022-03-10T13:16:42Z-
dc.date.issued2021
dc.identifier.issn2214157X
dc.identifier.other2-s2.0-85103070337
dc.identifier.urihttps://ir.swu.ac.th/jspui/handle/123456789/17272-
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85103070337&doi=10.1016%2fj.csite.2021.100904&partnerID=40&md5=7419d436c4aa0555c86ae104c7274b98
dc.description.abstractThe graphic processing unit is the active component that is an important heat source in electronic devices. The GPU cooling system's thermal dissipation performance with de-ionized water and nanofluid as coolants are presented. In the experiment, the GPU cooling system was embedded with the personal computer's GPU board, which in the overclock operating condition. The Ag nanofluid with 0.015% by volume concentration and de-ionized water is used as coolants flowing in the cooling system, considering the effects of coolant types and heat sink configurations on the thermal resistance. It found that the nanoparticles suspending in the base fluid significantly impact the nanofluid's physical properties and flow features, which results in higher removal capacity and, consequently, lower thermal resistance. The heat sink with a lower flow channel gives lower thermal resistance than those from higher ones. The results from this work have been used to develop a knowledge base that can be used to a design-related thermal cooling system for GPU or other components of electronic devices. © 2021 The Author(s).
dc.languageen
dc.subjectChannel flow
dc.subjectComputer operating systems
dc.subjectCoolants
dc.subjectCooling systems
dc.subjectElectronic cooling
dc.subjectGraphics processing unit
dc.subjectHeat resistance
dc.subjectHeat sinks
dc.subjectIonization
dc.subjectKnowledge based systems
dc.subjectPersonal computers
dc.subjectThermoanalysis
dc.subjectThermoelectric equipment
dc.subjectActive components
dc.subjectElectronic device
dc.subjectGraphic processing units
dc.subjectOperating condition
dc.subjectRemoval capacity
dc.subjectThermal cooling
dc.subjectThermal dissipation
dc.subjectVolume concentration
dc.subjectNanofluidics
dc.titleStudy on the thermal dissipation performance of GPU cooling system with nanofluid as coolant
dc.typeArticle
dc.rights.holderScopus
dc.identifier.bibliograpycitationCase Studies in Thermal Engineering. Vol 25, No. (2021)
dc.identifier.doi10.1016/j.csite.2021.100904
Appears in Collections:Scopus 1983-2021

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