Please use this identifier to cite or link to this item: https://ir.swu.ac.th/jspui/handle/123456789/14335
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dc.contributor.authorKumfu S.
dc.contributor.authorJintakosol T.
dc.date.accessioned2021-04-05T03:34:15Z-
dc.date.available2021-04-05T03:34:15Z-
dc.date.issued2012
dc.identifier.issn10226680
dc.identifier.other2-s2.0-84860818090
dc.identifier.urihttps://ir.swu.ac.th/jspui/handle/123456789/14335-
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84860818090&doi=10.4028%2fwww.scientific.net%2fAMR.506.453&partnerID=40&md5=ebe3a24537c671bd4dc1943fa58dfa8e
dc.description.abstractThe objective of this study was to investigate the thermal property of thermal insulation board produced from admixtures of pineapple leaf fiber and natural rubber latex at different proportion level and the thermal property was evaluated based on the American Society for Testing Materials standard. Thermal insulation boards were fabricated using a hot pressing technique at a temperature of 150 °C under a pressure of 100 kg/cm 2 for 5 min to form a squared thermal insulation with the size of 35 cm and 0.9 cm thickness. The thermal conductivity of the thermal insulation was 0.057 W/m K with density of 338 kg/m 3. The success of this study primarily proclaims a high feasibility of producing thermal insulation from pineapple leaf fiber and natural rubber latex as a substitute for synthetic fiber. © (2012) Trans Tech Publications.
dc.subjectAmerican society for testing materials
dc.subjectNatural rubber latex
dc.subjectPineapple leaf fiber
dc.subjectThermal insulation boards
dc.subjectBiological materials
dc.subjectHot pressing
dc.subjectLatexes
dc.subjectRubber
dc.subjectRubber testing
dc.subjectSynthetic fibers
dc.subjectThermal insulation
dc.subjectThermodynamic properties
dc.subjectThermal conductivity
dc.titleThermal insulation produced from pineapple leaf fiber and natural rubber latex
dc.typeConference Paper
dc.rights.holderScopus
dc.identifier.bibliograpycitationAdvanced Materials Research. Vol 506, No. (2012), p.453-456
dc.identifier.doi10.4028/www.scientific.net/AMR.506.453
Appears in Collections:Scopus 1983-2021

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