| dc.contributor.author |
Srisukho P. |
|
| dc.contributor.author |
Wongpreedee K. |
|
| dc.date.accessioned |
2021-04-05T03:32:46Z |
|
| dc.date.available |
2021-04-05T03:32:46Z |
|
| dc.date.issued |
2013 |
|
| dc.identifier.issn |
10226680 |
|
| dc.identifier.other |
2-s2.0-84886279083 |
|
| dc.identifier.uri |
https://ir.swu.ac.th/jspui/handle/123456789/13973 |
|
| dc.identifier.uri |
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84886279083&doi=10.4028%2fwww.scientific.net%2fAMR.787.167&partnerID=40&md5=7fe83439da78e8b9693e67c0bc91acd4 |
|
| dc.description.abstract |
Niello bars contain Lead which prohibits by laws and danger to environment. This research was to study the effects of temperatures which a black amalgam of lead-free niello bar alloys was filled in carved grooves of 95wt%Ag-5wt%Cu and 99.99wt%Ag substrates at 400°C, 500°C, 600°C and 700°C. Three compositions of lead-free niello bar alloys were selected in this research. The characterizations of microstructure, interface layers, and porosities of lead-free niello bar alloys after applying were reported. The results showed that all three compositions contain six compounds of CuAgS, Ag, Cu2S, Sn2S3, SnS and Cu4SnS4. After applying lead-free niello bar alloys on the substrates, it showed that composition #2 on the 95wt%Ag-5wt%Cu substrates was matched to the best condition of temperature at 600°C giving lowest porosities. © (2013) Trans Tech Publications, Switzerland. |
|
| dc.subject |
Ag substrate |
|
| dc.subject |
Cu substrate |
|
| dc.subject |
Effects of temperature |
|
| dc.subject |
Interface layer |
|
| dc.subject |
Lead-Free |
|
| dc.subject |
Nielli inlay |
|
| dc.subject |
Nielloware |
|
| dc.subject |
Silver substrate |
|
| dc.subject |
Alloys |
|
| dc.subject |
Characterization |
|
| dc.subject |
Copper compounds |
|
| dc.subject |
Environmental regulations |
|
| dc.subject |
Interfaces (materials) |
|
| dc.subject |
Porosity |
|
| dc.subject |
Research |
|
| dc.subject |
Silver |
|
| dc.subject |
Soldering alloys |
|
| dc.subject |
Tin |
|
| dc.subject |
Silver alloys |
|
| dc.title |
The effects of depositing Sn-Ag-Cu-S systems at different temperatures on silver substrates |
|
| dc.type |
Conference Paper |
|
| dc.rights.holder |
Scopus |
|
| dc.identifier.bibliograpycitation |
Advanced Materials Research. Vol 787, No. (2013), p.167-171 |
|
| dc.identifier.doi |
10.4028/www.scientific.net/AMR.787.167 |
|