Please use this identifier to cite or link to this item: http://ir.swu.ac.th/jspui/handle/123456789/17322
Title: Heat transfer enhancement of thermoelectric cooling module with nanofluid and ferrofluid as base fluids
Authors: Wiriyasart S.
Suksusron P.
Hommalee C.
Siricharoenpanich A.
Naphon P.
Keywords: Battery Pack
Coolants
Heat resistance
Heat sinks
Iron oxides
Magnetic fluids
Magnetite
Oxide minerals
Peltier effect
Thermal management (electronics)
Thermoelectric equipment
Thermoelectric refrigeration
Titanium dioxide
Compact heat sink
Constant temperature
Heat Transfer enhancement
Maximum heat transfer
Temperature differences
Thermal Performance
Thermoelectric cooler
Thermoelectric cooling
Nanofluidics
Issue Date: 2021
Abstract: In this study, the thermal performance of a compact heat sink thermoelectric cooling module with water, nanofluid, and ferrofluid as the coolants is investigated experimentally. The TiO2 nanofluid and Fe3O4 ferrofluid were tested at concentrations of 0.005% and 0.015%, respectively. The dummy battery pack was filled with water under a constant temperature and represented as a heat load. The results reveal that the Fe3O4 ferrofluid showed a maximum heat transfer rate 11.17% and 12.57% higher, respectively, than that of the TiO2 nanofluid and water. The TiO2 nanofluid and Fe3O4 ferrofluid with a 0.015% concentration enhanced the Peltier effect by lowering the contribution of the Fourier effect of the thermoelectric cooler (TEC), decreasing the temperature difference of the TEC cooling module by 4.6% and 9.6%, respectively, which decreases the thermal resistance of the heat sink by 7% and 14%, respectively. More importantly, the use of nanofluids and ferrofluids with a 0.015% concentration as coolants increased the pressure drop significantly, by 0.5 kPa and 2.7 kPa, respectively, compared with water. © 2021 The Author(s).
URI: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85100896803&doi=10.1016%2fj.csite.2021.100877&partnerID=40&md5=1a90eec7776359bbfddee004cf4741ba
http://ir.swu.ac.th/jspui/handle/123456789/17322
ISSN: 2214157X
Appears in Collections:Scopus 1983-2021

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