Please use this identifier to cite or link to this item: http://ir.swu.ac.th/jspui/handle/123456789/12311
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dc.contributor.authorWiriyasart S.
dc.contributor.authorHommalee C.
dc.contributor.authorNaphon P.
dc.date.accessioned2021-04-05T03:02:45Z-
dc.date.available2021-04-05T03:02:45Z-
dc.date.issued2019
dc.identifier.issn2214157X
dc.identifier.other2-s2.0-85064206944
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85064206944&doi=10.1016%2fj.csite.2019.100445&partnerID=40&md5=a70c41a3c3011c4e9649edc5832e92bc
dc.identifier.urihttp://ir.swu.ac.th/jspui/handle/123456789/12311-
dc.description.abstractThe thermal cooling enhancement technique of dual processors workstation computer couple thermoelectric air cooler module is studied experimentally. The monitored parameters mainly focus on the computer load conditions, with and without thermoelectric air cooler module, cooling fan turns on/off modes, and different cooling fan sizes. In experiment process, the working computer load of 0-100% is performed. The temperature distribution inside the computer chassis depends on the density, position of the components inside the computer both active and passive components. It is found that the thermoelectric air cooler module has a significant effect on the air and the CPU temperatures of the dual processor computer. In addition, the operating modes, positions and sizes of the cooling fan have significant effect on air distribution inside the computer chassis. However, energy consumption is also increased. The results of this study are expected to lead to guidelines that will allow the design of the cooling system with improved heat transfer performance of the electronic equipment. © 2019 The Authors. Published by Elsevier Ltd.
dc.subjectChassis
dc.subjectComputer workstations
dc.subjectCooling systems
dc.subjectEnergy utilization
dc.subjectHeat transfer performance
dc.subjectOscillators (electronic)
dc.subjectThermal management (electronics)
dc.subjectAir cooler
dc.subjectAir distribution
dc.subjectDual processor computer
dc.subjectDual processors
dc.subjectLoad condition
dc.subjectMonitored parameters
dc.subjectOperating modes
dc.subjectThermal cooling
dc.subjectElectronic cooling
dc.titleThermal cooling enhancement of dual processors computer with thermoelectric air cooler module
dc.typeArticle
dc.rights.holderScopus
dc.identifier.bibliograpycitationCase Studies in Thermal Engineering. Vol 14, (2019)
dc.identifier.doi10.1016/j.csite.2019.100445
Appears in Collections:Scopus 1983-2021

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